august 2012 ? 2011 fairchild semiconductor corporation www.fairchildsemi.com fsa850 ? rev. 1.0.0 fsa850 audio 3-pole / 4-pole mic-gnd switch fsa850 audio 3-pole / 4-pole mic-gnd switch features switch type 3-pole/4-pole mic - gnd v cc 2.3 to 4.5 v thd (mic) 0.001% typical esd iec 61000-4-2 (air gap) iec 61000-4-2 (contact) hbm (all pins) gndna/gndnb to gnd power to gnd cdm 15 kv 8 kv 3 kv 8 kv 10 kv 2 kv operating temperature -40c to 85c r on maximum (gnd1n) 0.08 ? r on maximum (sense) 1 ? applications ? 3.5 mm and 2.5 mm audio jacks ? cellular phones, smart phones ? mp3 and pmp (portable media player) description the fsa850 is a 3-pole or 4-pole audio jack microphone gnd switch for accessories with general-purpose input / output (gpio) control signals. the fsa850 also has the ability to perform 4-pole cross-point switching to support open mobile terminal platform (omtp) 4-pole headset plugs. the architecture is designed to replace discrete mosfet solutions and allow common third-party headphones to be used for listening to music or playing video from mobile handsets, personal media players, and portable peripheral devices. ? supports 4-pole omtp cross point switching for gnd connection ? integrates a mic switch for 3- or 4-pole configuration headset plugs ? reduces ?pop and click? caused by microphone bias related resources ? for samples and questions, please contact: analog.switch@fairchildsemi.com . typical application figure 1. typical mobile application
? 2011 fairchild semiconductor corporation www.fairchildsemi.com fsa850 ? rev. 1.0.0 6 fsa850 audio 3-pole / 4-pole mic-gnd switch physical dimensions figure 4. 12-bump, wafer-level chip scale package (wlcsp), 1.2mmx1.6mm, 0.4mm pitch ordering information part number operating temperature range top mark package d e x y FSA850UCX -40 to +85c m5 12-ball, wafer-level chip-scale package (wlcsp), 3x4 array, 0.4mm pitch, 250 m ball 1.16 mm 1.56 mm 0.18 mm 0.18 mm bottom view side views top view recommended land pattern (nsmd pad type) notes: a. no jedec registration applies. b. dimensions are in millimeters. c. dimensions and tolerances per asme y14.5m, 1994. d. datum c is defined by the spherical crowns of the balls. e. package nominal height is 586 microns 39 microns (547-625 microns). f. for dimensions d, e, x, and y see product datasheet. g. drawing filename: mkt-uc012acrev1. 0.40 0.40 0.80 1.20 ?0.2600.02 12x (x)0.018 (y)0.018 a b c d 123 2x pin 1 area 0.03 c e d a b 2x 0.03 c 0.05 c 0.625 0.547 c 0.3780.018 0.2080.021 seating plane d f f (?0.200) cu pad (?0.300) solder mask 0.40 0.80 1.20 0.40 0.005 cab
? 2011 fairchild semiconductor corporation www.fairchildsemi.com fsa850 ? rev. 1.0.0 7 fsa850 audio 3-pole / 4-pole mic-gnd switch
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